Waterborne Polyamide-Imide Resin, 25% Solids and 6H Hardness

Cat No:PPPP-0047

Description

A reddish-brown, water-dilutable polyamide-imide resin formulation developed for heat-resistant adhesives, protective coatings, fluoropolymer systems and electrical insulation. It combines strong adhesion to metal, wear resistance, dielectric performance, self-lubricating behavior and high-temperature curing capability.

Datasheet

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Basic Information

Chemical Name	Waterborne polyamide-imide resin
Synonyms	Waterborne PAI resin; polyamide-imide coating resin
Appearance	Reddish-brown viscous liquid
Viscosity	1,200-3,500 mPa·s (cP), measured at 25 °C with a rotational viscometer
Features and Benefits	Water-dilutable formulation with self-lubricating behavior, high- and low-temperature resistance, wear resistance, strong mechanical performance, good dielectric properties, high adhesion to metal substrates and reliable high-temperature curing performance.
Usage Instructions	For improved leveling and reduced edge shrinkage, an appropriate compatible surface-active additive may be incorporated at 1.0-2.0 parts per thousand. Preheat the coated substrate at 140-150 °C for 10 min, then raise the temperature above 250 °C and cure for 30 min.
Recommended Use Level	Optional compatible leveling additive: 1.0-2.0 parts per thousand
Storage Conditions	Store below 35 °C in a cool, ventilated area away from acids, alkalis, ignition sources and heat.
Transport Classification	Handle and transport as a combustible-solvent formulation.
Solid Content	25 ± 2% after 0.5 h at 200 °C
Curing Conditions	Test condition: 280 °C for 10 min on an aluminum panel. Recommended schedule: preheat at 140-150 °C for 10 min, then cure above 250 °C for 30 min.
Product Standard	nan
PID Resistance	nan
Component System	Polyamide-imide resin with mixed co-solvents, water and functional processing aids
Solvent System	NMP / DMAc / water = 30 / 30 / 40
Heat Resistance	200 h at 300 °C
Pencil Hardness	6H
Flexibility	180° fold without cracking
Composition	Polyamide-imide resin, mixed co-solvents, water and functional processing aids
Adhesion	High adhesion to metal substrates

Applications

Waterborne heat-resistant adhesives and coatings; waterborne fluoropolymer coatings; electrical insulating coatings; appliance coatings; hardware and metal-protection systems.

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