Silicon Nitride Sputtering Target product detail at Eata Ray
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Silicon Nitride Sputtering Target

Silicon Nitride Sputtering Target

Cat No:SBM-ISM-0056

Description

This silicon nitride deposition target supplies a controlled ceramic source for PVD processes that create dielectric, protective, optical, or barrier coatings on semiconductor, glass, sensor, and research substrates while supporting repeatable thin-film process development.

Basic Information

Chemical Formula Si3N4
Molecular Weight 140.28 g/mol
Appearance Powder/ceramic/target/wafer/structured solid
Density 3.2 g/cm3
Melting Point 1900°C
Solubility in H2O Insoluble
Young's Modulus 250-320 GPa
Vickers Hardness 1400-1600 HV
Thermal Conductivity 30 W/mK
Electrical Resistivity Semiconductor/insulator
Electronegativity (Pauling) 1.90
Hazard Statements Dust hazard depending on form
Hazard Codes GHS07
Precautionary Statements Avoid inhalation
Transport Information Transportation classification depends on the product form.
Packaging Specification Powder, target, wafer, ceramic parts, fiber or custom packaging

Applications

Applications Dielectric Film Formation: Deposits electrically insulating layers for electronic structures. Optical Stack Engineering: Supports nitride layers with useful refractive properties. Surface Protection: Produces hard coatings for selected substrates. Thin-Film Research: Enables controlled studies of nitride composition and process conditions.

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Eata Silicon delivers a diverse portfolio of silicon-based materials, from high-purity silicon and inorganic silicon compounds to functional silicon materials and customized solutions, supporting research, manufacturing, and next-generation applications across multiple industries.

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For Research or Industrial Raw Materials, Not For Personal Medical Use!

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