High-Modulus Clear Reprographic Silicone, 100 g Kit

Cat No:SRE-0083

Description

A clear high-modulus silicone molding and encapsulation compound designed to reduce deformation associated with compliant silicone in soft-lithography structures.

Datasheet

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Basic Information

Appearance	Clear
Viscosity	500-750 cSt, mixed
Specific Gravity	0.98
Refractive Index	1.41 at 25 degrees C
Boiling Point	Not available
Color	Clear
Features and Benefits	A clear high-modulus silicone molding and encapsulation compound designed to reduce deformation associated with compliant silicone in soft-lithography structures.
Usage Instructions	Mix the two components at the stated ratio while limiting air inclusion. De-air under vacuum for critical work, cast or coat, and cure under the listed conditions.
Packaging	100 g premeasured mixing-cup kit: 50 g Part A and 50 g Part B; 1 kg kit: 500 g Part A and 500 g Part B
Working Time	4 hours at 25 degrees C
Curing Conditions	80 degrees C for 4 hours or room temperature for 24 hours
Shore A Hardness	60-70
Tensile Strength	0.5-0.75 MPa
Elongation at Break	30-40%
Product Standard	nan
PID Resistance	nan
Component System	Two-part system
HMIS Rating	1-1-0-X
TSCA Status	Yes
Packaging Atmosphere	Nitrogen
Mix Ratio	1:1
Cure Type	Platinum-catalyzed addition cure
Part A Viscosity	800-1,200 cSt
Part B Viscosity	150-300 cSt

Applications

Soft lithography; high-modulus microstructures; clear molding and encapsulation.

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Eata Silicon delivers a diverse portfolio of silicon-based materials, from high-purity silicon and inorganic silicon compounds to functional silicon materials and customized solutions, supporting research, manufacturing, and next-generation applications across multiple industries.

For Research or Industrial Raw Materials, Not For Personal Medical Use!